For all subsequent layers after the first layer, do NOT re-prime the wafer. Two types of resist: v Positive resist - Exposed regions become more soluble. A negative mask is left after develop. With positive resist, the exposed regions are dissolved during develop. Developing the Image. The separation and free movement of the positively charged holes and the negatively charged electrons enables a current to be carried across the resistor. 7. Conductive and Opto-Electrical Antimony Tin Oxide Coatings for Particulate Materials, Different Materials Give Guitar Different Sounds. 7. Refractory Metals: An A to Z of Applications, Understanding the Importance of Gel Permeation Chromatography (GPC) in Commercially Available Industrial Polymer Analysis. Wafers with photoresist on them cannot be put in priming instruments.
Step 1: Spincoating & Prebaking